APPLICATION

DRY FILM TYPE

THICKNESS (mils)

MAIN FEATURES

• Copper, tin, plating
• Print/Tent & Etch

Ordyl Alpha 300

1.2 (Alpha 330)

1.6 (Alpha 340)

2.0 (Alpha 350)

3.0 (Alpha 375)

• Extreme resistance in alkaline solutions
• High resistance in Ni/Au Plating

Ordyl Alpha 800

1.0 (Alpha 825)

1.2 (Alpha 830)

1.6 (Alpha 840)

2.0 (Alpha 850)

• Extremely flexible and high conformability
• Easy stripping with small flake size

Ordyl Alpha 900

0.8 (Alpha 920)

1.2 (Alpha 930)

1.6 (Alpha 940)

2.0 (Alpha 950)

2.4 (Alpha 960)

• Extremely flexible and high conformability
• Good through cure polymerization
• Easy stripping with small flake size

Ordyl AM 100

1.2 (AM 130)

1.6 (AM 140)

2.0 (AM 150)

3.0 (AM 175)

• Excellent adhesion properties
• High exposure speed
• High flexibility and conformability
• Alkaline resistance

Ordyl AR 200S

1.6 (AR 240S)

2.0 (AR 250S)

• High flexibility and conformability
• Alkaline resistance

Ordyl FLR 4000

1.2 (FLR 4030)

1.6 (FLR 4040)

2.0 (FLR 4050)

• Excellent adhesion properties
• High exposure speed
• High flexibility and conformability
• Very small flake size
• Copper, tin, plating
• Print/Tent & Etch
• LDI exposure

• Copper, tin, plating
• Print/Tent & Etch
• LDI exposure

Ordyl Alpha 900NDI

0.8 (Alpha 920NDI)

1.2 (Alpha 930NDI)

1.6 (Alpha 940NDI)

2.0 (Alpha 950NDI)

2.4 (Alpha 960NDI)

• Absence of developing sludge
• Very good through cure polymerization also with LDI exposure machine over 50µm resist thickness
• Easy stripping with small flake size

Ordyl AM 100DI

0.6 (AM 115DI)

0.8 (AM 120DI)

1.2 (AM 130DI)

1.6 (AM 140DI)

2.0 (AM 150DI)

2.4 (AM 160DI)

• Excellent through cure polymerization also with LDI exposure machine over 50µm resist thickness
• Excellent adhesion properties due to special adhesion promoter
• Very High Photospeed
• High flexibility and conformability
• Alkaline resistance

Ordyl FLR 1000

1.2 (FLR 1030)

1.6 (FLR 1040)

2.0 (FLR 1050)

• Excellent through cure polymerization also with LDI exposure machine over 50µm resist thickness
• Excellent adhesion properties due to special adhesion promoter
• High Photospeed
• High flexibility and conformability
• Very small flake size
• Copper, tin, plating
• Print/Tent & Etch
• 405nm LDI exposure

• Copper, tin, plating

• Print/Tent & Etch

• 405nm LDI exposure

Ordyl AM 400

1.2 (AM 430)

1.6 (AM 440)

2.0 (AM 450)

• Extremely short exposure times when using the 405nm wavelength
• Alkaline resistance

Ordyl AM 900

1.2 (AM 930)

1.6 (AM 940)

2.0 (AM 950)

• Extremely short exposure times
• Suitable for mixing with wavelengths of 405nm integration and standard UV

Ordyl FLR 9000

1.2 (FLR 1030)

1.6 (FLR 1040)

2.0 (FLR 1050)

• Very short exposure times
• Suitable for mixing with wavelengths of 405nm integration and standard UV
• Very small flake size

• Chemical Milling

Ordyl AF 200E

Ordyl AF 200 LDI

0.8 (AF 220E)

1.2 (AF 230E)

1.6 (AF 240E)

2.0 (AF 250E)

• Excellent adhesion on stainless steel
• Suitable for LDI exposure machines

(AF 200LDI)

• Chemical Milling
• Electroforming
• ENIG process

Ordyl NE 500

0.6 (NE 515)

1.0 (NE 525)

1.6 (NE 540)

2.0 (NE 550)

• Excellent adhesion to stainless steel
• Very good resistance in ENIG process
• Ultra Fine Line

•  Ultra-fine line

Ordyl FP 400

0.6 (FP 415)

1.0 (FP 425)

1.6 (FP 440)

2.0 (FP 450)

• Excellent resolution up to 1: 2

(i.e. with 40 µm film thickness can be achieved resolution of 20µm)

Ordyl FP 700

0.8 (FP 720)

1.6 (FP 740)

• Excellent resolution up to 1: 2

(i.e. with 40 µm film thickness can be achieved resolution of 20µm)

• Packaging

Ordyl P-50000

4.0 (P50100)

5.0 (P50125)

• Excellent through cure polymerization even at thicknesses above 100 microns
• Permanent resist for MEMS und Biochips Packaging

• Permanent resist for MEMS und Biochips Packaging

Ordyl SY 300

0.8 (SY 320)

1.6 (SY 330)

2.2 (SY 355)

• Excellent chemical resistance
• Biocompatible
• Heat resistant
• Good resolution