Ordyl® AM 900
Main Features:
- Excellent through cure polymerization
- Good adhesion properties
- Very high photospeed
- High flexibility and conformability
Typical Application:
- Acid etching
- Tenting process
- Copper, tin, tin/lead plating
Available Thickness:
- 30 µm (1.2 mils), 40 µm (1.6 mils), 50 µm (2.0 mils) and 60 µm (2.4 mils) for standard application
Exposure
We recommend using sources with emission peak at 405nm or double wavelength exposure systems (when one is 405nm).
The following parameters are referred to:
- 6-9 solid STEP of SST21
- 16-27 solid STEP of SST41
- 7-18 solid STEP of RST25
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AM 930
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AM 940
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AM 950
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AM 960
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Energy
(mJ/cm2)
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14-20
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16-22 |
18-24 |
22-28
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Resolution
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30 µm (1.2 mils)
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40 µm (1.6 mils)
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50 µm (2.0 mils)
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60 µm (2.4 mils)
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Photogallery
Attachments
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