Alpha 900 is a soft-plastic film with very good conformability to the substrate. Is reccommended for copper plating and tenting with acid etching. Adhesion to substrate is good , stripping time about 100 seconds, size of stripped film medium-small.

ALPHA 900 series of dry film resists are designed to be developed and stripped in mindly alkaline solutions.
It offers superior performances and resistance to leaching in all the most commonly used plating baths used in
printed circuits manufacturing ;Alpha 900 is highly resistant to acid etching processes.
Alpha 900 is extremely flexible , ensuring reliable tenting performance even on large tooling holes; good tenting
perfomance can be achieved with resist of 40 micron and thicker.
Alpha 900 has excellent adhesion and definition characteristics producing very high yields on fine line technologies.

Recommended thickness for different application.

30 micron Acid etching.
40 micron Tenting, copper, tin, tin lead, plating, acid etching.
50 micron Tenting, copper, tin, tin lead, plating, acid etching.